Just last month, Comsol, Burlington, Mass., released the latest version of its Multiphysics, version 4.3b which con- tains five new application-specific modules and expanded modeling and analysis tools.
The five new modules include:
• Multibody Dynamics Module – This module
provides users with the ability to analyze the
assembly of rigid and flexible bodies. Transitional and rotational displacements, as well as
locking, can be simulated for a variety of joint
types, including prismatic, hinge, cylindrical
screw, planar, ball, slot, and reduced slot joints.
• Geometry and Mesh – A new feature that
allows users to make quick what-if studies by
taking a 2D geometry from the cross-section
of a 3D geometry. A new curvilinear coordinate system tool makes it easier to define
anisotropic materials in curved geometric
shapes. Also, increased automated swept
meshing capabilities allow for faster modeling.
• Wave Optics Module – This module allows
users to analyze electromagnetic wave propagation in optically large structures, such as
optical fibers and sensors, bidirectional couplers, plasmonic devices, metamaterials, laser
beam propagation, and non-linear optical
• Interfacing and Productivity – A new One
Window Interface with LiveLink for Inventor
allows users to work with Comsol Multiphysics from within the Inventor environment.
New updates in LiveLink for Excel allow you to
import multiple models and export material
data from Excel to Comsol.
• Molecular Flow Module – This module offers
users the capability to simulate rarefied gas
flow in complex CAD geometries of vacuum
systems. This includes such applications as
mass spectrometers, semiconductor processing, satellite technology, particle accelerators,
shale gas exploration, and flow in nanoporous
• Electrical – A new magnetics solver facilitates
faster stationary and time-dependent magnetics simulations. A new electrical contact
feature is added to the AC/DC Module; the
electric current flowing between two surfaces
now varies according to surface properties and
contact pressure. The periodic structures for
electromagnetic waves feature is now available
in the RF Module.
• Semiconductor Module – This module
enables the detailed analysis of semiconductor
device operations at the fundamental physics
level allowing for the modeling of PN junctions, bipolar transistors, MOSFETs, MES-FE Ts, thyristors, and Schottky diodes.
• Mechanical – Bolt pre-tension and beam
cross-section analysis can now be simulated in
the Structural Mechanics Module. Cumulative damage for fatigue analysis with random
amplitude loads is now available in the Fatigue
Module. The Heat Transfer Module has been
enhanced with multiwavelength surface-to-surface heat radiation, heat transfer with phase
change, and thermal contact features.
• Electrochemistry Module – This module has
tailored interfaces that are now available for
electroanalysis, electrolysis, and electrodialysis.
Typical applications include: glucose sensors,
gas sensors, chlor-alkali electrolysis, desalination of seawater, waste water treatment, and
control of electrochemical reactions in biomedical implants.
• Fluid – The new frozen rotor feature in the
CFD Module efficiently solves for the pseudo-steady flow field in rotating machinery for
laminar and turbulent flow. A new thin screen
feature for thin permeable barriers allows the
simulation of wire gauzes, grills, and perforated
plates. Additionally, the SST turbulence model
and a new CFD solver are now available.
The expanded modeling and analysis tools
• Chemical – The new thin impermeable barrier for mass transport feature allows users
to represent thin walls as interior boundaries
with a no-mass-flux condition on both sides.